Transfer laminate circuit process for fine pitch wiring technology

Transfer laminate circuit process for fine pitch wiring technology

The transfer laminate circuit (TLC) process is presented which has a vast potential for extending the wiring density of laminated multichip modules (MCM-Ls) to a level of deposited MCMs (MCM-Ds). In this paper, factors affecting the resolution of wiring patterns produced by TLC process are studied a...

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Bibliographische Detailangaben
Hauptverfasser: Tsubomatsu, Y., Yoshidomi, Y., Ohhata, H., Yamazaki, T., Fukutomi, N.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Copper
Dielectric substrates
Dry etching
Fabrication
Geometry
Integrated circuit interconnections
Laminates
Pattern formation
Resists
Wiring
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Beschreibung
Zusammenfassung:The transfer laminate circuit (TLC) process is presented which has a vast potential for extending the wiring density of laminated multichip modules (MCM-Ls) to a level of deposited MCMs (MCM-Ds). In this paper, factors affecting the resolution of wiring patterns produced by TLC process are studied and a feasibility of making fine pitch wiring patterns is demonstrated.< >
DOI:10.1109/ECTC.1994.367581