A computationally efficient method for modeling circuits housed in non-rectangular packages

A computationally efficient method for modeling circuits housed in non-rectangular packages

Mathematical difficulties make a solution for parasitic impedances in packaged microstrip circuits problematic. Because of this, most present simulators model rectangular packages. In this paper, a method developed for rectangular packages is generalized to model packages with other cross sections....

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Hauptverfasser: Ferry, R.M., Dunn, J.M., Booton, R.C.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Circuit simulation
Computational modeling
Impedance
Microstrip
Packaging
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creator Ferry, R.M.
Dunn, J.M.
Booton, R.C.
description Mathematical difficulties make a solution for parasitic impedances in packaged microstrip circuits problematic. Because of this, most present simulators model rectangular packages. In this paper, a method developed for rectangular packages is generalized to model packages with other cross sections. Reasonable accuracy is shown for a computationally efficient simulation of circuits housed in a package with trapezoidal cross section.< >
doi_str_mv 10.1109/MWSYM.1994.335284
format Conference Proceeding
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ispartof 1994 IEEE MTT-S International Microwave Symposium Digest (Cat. No.94CH3389-4), 1994, p.1527-1529 vol.3
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source IEEE Electronic Library (IEL) Conference Proceedings
subjects Circuit simulation
Computational modeling
Impedance
Microstrip
Packaging
title A computationally efficient method for modeling circuits housed in non-rectangular packages
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