A computationally efficient method for modeling circuits housed in non-rectangular packages

A computationally efficient method for modeling circuits housed in non-rectangular packages

Mathematical difficulties make a solution for parasitic impedances in packaged microstrip circuits problematic. Because of this, most present simulators model rectangular packages. In this paper, a method developed for rectangular packages is generalized to model packages with other cross sections....

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Ferry, R.M., Dunn, J.M., Booton, R.C.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Circuit simulation
Computational modeling
Impedance
Microstrip
Packaging
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Beschreibung
Zusammenfassung:Mathematical difficulties make a solution for parasitic impedances in packaged microstrip circuits problematic. Because of this, most present simulators model rectangular packages. In this paper, a method developed for rectangular packages is generalized to model packages with other cross sections. Reasonable accuracy is shown for a computationally efficient simulation of circuits housed in a package with trapezoidal cross section.< >
ISSN:0149-645X
2576-7216
DOI:10.1109/MWSYM.1994.335284