Stress, microstructure and materials reliability of sputter-deposited Fe-N films

Stress, microstructure and materials reliability of sputter-deposited Fe-N films

Sputtered Fe-N films with various nitrogen contents were investigated from point of view of device manufacturing. As-deposited Fe-N films have compressive stress that becomes tensile due to heat treatment. At optimum N content where soft magnetic properties were realized, the film shows a close to a...

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Veröffentlicht in:IEEE transactions on magnetics 1994-11, Vol.30 (6), p.3921-3923
Hauptverfasser: Narayan, P.B., Kim, Y.K.
Format: Artikel
Sprache:eng
Schlagworte:
Amorphous materials
Compressive stress
Heat treatment
Magnetic films
Magnetic properties
Manufacturing
Materials reliability
Microstructure
Nitrogen
Tensile stress
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container_title IEEE transactions on magnetics
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creator Narayan, P.B.
Kim, Y.K.
description Sputtered Fe-N films with various nitrogen contents were investigated from point of view of device manufacturing. As-deposited Fe-N films have compressive stress that becomes tensile due to heat treatment. At optimum N content where soft magnetic properties were realized, the film shows a close to amorphous microstructure. Compared to NiFe, Fe-N has higher reactivity with humidity and lower reactivity with atmospheric pollutants such as Cl and S.< >
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fullrecord <record><control><sourceid>proquest_RIE</sourceid><recordid>TN_cdi_ieee_primary_333944</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>333944</ieee_id><sourcerecordid>28594774</sourcerecordid><originalsourceid>FETCH-LOGICAL-c350t-a3f8a9ceff7a8b4c5df2752fb1e9754f37345426c9c90002aa1ffb17077268893</originalsourceid><addsrcrecordid>eNqNkE1LxDAQQIMouK4evHrKSRDsOvlokxxlcVVYVFDPJZtOINJu1yQ97L-3S8Wzp2F4b-bwCLlksGAMzB2HhRDCSHlEZsxIVgBU5pjMAJgujKzkKTlL6WtcZclgRt7ec8SUbmkXXOxTjoPLQ0Rqtw3tbMYYbJtoxDbYTWhD3tPe07Qb8oiKBnd9ChkbusLihfrQdumcnPjxBC9-55x8rh4-lk_F-vXxeXm_LpwoIRdWeG2NQ--V1RvpysZzVXK_YWhUKb1QQpaSV844AwDcWuZHqEApXmltxJxcT393sf8eMOW6C8lh29ot9kOqudaVMUr_QyyNVEqO4s0kHkKkiL7exdDZuK8Z1Ie4NYd6iju6V5MbEPHP-4U_vBx0dg</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>28594774</pqid></control><display><type>article</type><title>Stress, microstructure and materials reliability of sputter-deposited Fe-N films</title><source>IEEE Xplore</source><creator>Narayan, P.B. ; Kim, Y.K.</creator><creatorcontrib>Narayan, P.B. ; Kim, Y.K.</creatorcontrib><description>Sputtered Fe-N films with various nitrogen contents were investigated from point of view of device manufacturing. As-deposited Fe-N films have compressive stress that becomes tensile due to heat treatment. At optimum N content where soft magnetic properties were realized, the film shows a close to amorphous microstructure. Compared to NiFe, Fe-N has higher reactivity with humidity and lower reactivity with atmospheric pollutants such as Cl and S.&lt; &gt;</description><identifier>ISSN: 0018-9464</identifier><identifier>EISSN: 1941-0069</identifier><identifier>DOI: 10.1109/20.333944</identifier><identifier>CODEN: IEMGAQ</identifier><language>eng</language><publisher>IEEE</publisher><subject>Amorphous materials ; Compressive stress ; Heat treatment ; Magnetic films ; Magnetic properties ; Manufacturing ; Materials reliability ; Microstructure ; Nitrogen ; Tensile stress</subject><ispartof>IEEE transactions on magnetics, 1994-11, Vol.30 (6), p.3921-3923</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c350t-a3f8a9ceff7a8b4c5df2752fb1e9754f37345426c9c90002aa1ffb17077268893</citedby><cites>FETCH-LOGICAL-c350t-a3f8a9ceff7a8b4c5df2752fb1e9754f37345426c9c90002aa1ffb17077268893</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/333944$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>314,780,784,796,27924,27925,54758</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/333944$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Narayan, P.B.</creatorcontrib><creatorcontrib>Kim, Y.K.</creatorcontrib><title>Stress, microstructure and materials reliability of sputter-deposited Fe-N films</title><title>IEEE transactions on magnetics</title><addtitle>TMAG</addtitle><description>Sputtered Fe-N films with various nitrogen contents were investigated from point of view of device manufacturing. As-deposited Fe-N films have compressive stress that becomes tensile due to heat treatment. At optimum N content where soft magnetic properties were realized, the film shows a close to amorphous microstructure. Compared to NiFe, Fe-N has higher reactivity with humidity and lower reactivity with atmospheric pollutants such as Cl and S.&lt; &gt;</description><subject>Amorphous materials</subject><subject>Compressive stress</subject><subject>Heat treatment</subject><subject>Magnetic films</subject><subject>Magnetic properties</subject><subject>Manufacturing</subject><subject>Materials reliability</subject><subject>Microstructure</subject><subject>Nitrogen</subject><subject>Tensile stress</subject><issn>0018-9464</issn><issn>1941-0069</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>1994</creationdate><recordtype>article</recordtype><recordid>eNqNkE1LxDAQQIMouK4evHrKSRDsOvlokxxlcVVYVFDPJZtOINJu1yQ97L-3S8Wzp2F4b-bwCLlksGAMzB2HhRDCSHlEZsxIVgBU5pjMAJgujKzkKTlL6WtcZclgRt7ec8SUbmkXXOxTjoPLQ0Rqtw3tbMYYbJtoxDbYTWhD3tPe07Qb8oiKBnd9ChkbusLihfrQdumcnPjxBC9-55x8rh4-lk_F-vXxeXm_LpwoIRdWeG2NQ--V1RvpysZzVXK_YWhUKb1QQpaSV844AwDcWuZHqEApXmltxJxcT393sf8eMOW6C8lh29ot9kOqudaVMUr_QyyNVEqO4s0kHkKkiL7exdDZuK8Z1Ie4NYd6iju6V5MbEPHP-4U_vBx0dg</recordid><startdate>19941101</startdate><enddate>19941101</enddate><creator>Narayan, P.B.</creator><creator>Kim, Y.K.</creator><general>IEEE</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>8FD</scope><scope>L7M</scope><scope>8BQ</scope><scope>JG9</scope></search><sort><creationdate>19941101</creationdate><title>Stress, microstructure and materials reliability of sputter-deposited Fe-N films</title><author>Narayan, P.B. ; Kim, Y.K.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c350t-a3f8a9ceff7a8b4c5df2752fb1e9754f37345426c9c90002aa1ffb17077268893</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>1994</creationdate><topic>Amorphous materials</topic><topic>Compressive stress</topic><topic>Heat treatment</topic><topic>Magnetic films</topic><topic>Magnetic properties</topic><topic>Manufacturing</topic><topic>Materials reliability</topic><topic>Microstructure</topic><topic>Nitrogen</topic><topic>Tensile stress</topic><toplevel>online_resources</toplevel><creatorcontrib>Narayan, P.B.</creatorcontrib><creatorcontrib>Kim, Y.K.</creatorcontrib><collection>CrossRef</collection><collection>Electronics &amp; Communications Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>METADEX</collection><collection>Materials Research Database</collection><jtitle>IEEE transactions on magnetics</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Narayan, P.B.</au><au>Kim, Y.K.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Stress, microstructure and materials reliability of sputter-deposited Fe-N films</atitle><jtitle>IEEE transactions on magnetics</jtitle><stitle>TMAG</stitle><date>1994-11-01</date><risdate>1994</risdate><volume>30</volume><issue>6</issue><spage>3921</spage><epage>3923</epage><pages>3921-3923</pages><issn>0018-9464</issn><eissn>1941-0069</eissn><coden>IEMGAQ</coden><abstract>Sputtered Fe-N films with various nitrogen contents were investigated from point of view of device manufacturing. As-deposited Fe-N films have compressive stress that becomes tensile due to heat treatment. At optimum N content where soft magnetic properties were realized, the film shows a close to amorphous microstructure. Compared to NiFe, Fe-N has higher reactivity with humidity and lower reactivity with atmospheric pollutants such as Cl and S.&lt; &gt;</abstract><pub>IEEE</pub><doi>10.1109/20.333944</doi><tpages>3</tpages></addata></record>
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subjects Amorphous materials
Compressive stress
Heat treatment
Magnetic films
Magnetic properties
Manufacturing
Materials reliability
Microstructure
Nitrogen
Tensile stress
title Stress, microstructure and materials reliability of sputter-deposited Fe-N films
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-07T17%3A27%3A18IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_RIE&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Stress,%20microstructure%20and%20materials%20reliability%20of%20sputter-deposited%20Fe-N%20films&rft.jtitle=IEEE%20transactions%20on%20magnetics&rft.au=Narayan,%20P.B.&rft.date=1994-11-01&rft.volume=30&rft.issue=6&rft.spage=3921&rft.epage=3923&rft.pages=3921-3923&rft.issn=0018-9464&rft.eissn=1941-0069&rft.coden=IEMGAQ&rft_id=info:doi/10.1109/20.333944&rft_dat=%3Cproquest_RIE%3E28594774%3C/proquest_RIE%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=28594774&rft_id=info:pmid/&rft_ieee_id=333944&rfr_iscdi=true