Stress, microstructure and materials reliability of sputter-deposited Fe-N films

Sputtered Fe-N films with various nitrogen contents were investigated from point of view of device manufacturing. As-deposited Fe-N films have compressive stress that becomes tensile due to heat treatment. At optimum N content where soft magnetic properties were realized, the film shows a close to a...

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Veröffentlicht in:IEEE transactions on magnetics 1994-11, Vol.30 (6), p.3921-3923
Hauptverfasser: Narayan, P.B., Kim, Y.K.
Format: Artikel
Sprache:eng
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Zusammenfassung:Sputtered Fe-N films with various nitrogen contents were investigated from point of view of device manufacturing. As-deposited Fe-N films have compressive stress that becomes tensile due to heat treatment. At optimum N content where soft magnetic properties were realized, the film shows a close to amorphous microstructure. Compared to NiFe, Fe-N has higher reactivity with humidity and lower reactivity with atmospheric pollutants such as Cl and S.< >
ISSN:0018-9464
1941-0069
DOI:10.1109/20.333944