Design SRAMs for burn-in
SRAM designers and product engineers must balance the diverse aspects involved in developing and manufacturing quality ICs. This paper describes how cost and complexity design techniques to improve burn-in, noting implications for performance, power and density.< >
Gespeichert in:
| Hauptverfasser: | , , , , |
|---|---|
| Format: | Tagungsbericht |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | 170 |
|---|---|
| container_issue | |
| container_start_page | 164 |
| container_title | |
| container_volume | |
| creator | Reohr, W. Yuen Chan Plass, D. Pelella, A. Wu, P. |
| description | SRAM designers and product engineers must balance the diverse aspects involved in developing and manufacturing quality ICs. This paper describes how cost and complexity design techniques to improve burn-in, noting implications for performance, power and density.< > |
| doi_str_mv | 10.1109/VTEST.1993.313330 |
| format | Conference Proceeding |
| fullrecord | <record><control><sourceid>ieee_6IE</sourceid><recordid>TN_cdi_ieee_primary_313330</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>313330</ieee_id><sourcerecordid>313330</sourcerecordid><originalsourceid>FETCH-ieee_primary_3133303</originalsourceid><addsrcrecordid>eNpjYJA0NNAzNDSw1A8LcQ0O0TO0tDTWMzY0NjY2YGbgtTS3MLAwtDAztjA2MOVg4C0uzjIAAhMTY3NjA04GCZfU4sz0PIXgIEffYoW0_CKFpNKiPN3MPB4G1rTEnOJUXijNzSDl5hri7KGbmZqaGl9QlJmbWFQZD7HGGK8kANRQKVw</addsrcrecordid><sourcetype>Publisher</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype></control><display><type>conference_proceeding</type><title>Design SRAMs for burn-in</title><source>IEEE Electronic Library (IEL) Conference Proceedings</source><creator>Reohr, W. ; Yuen Chan ; Plass, D. ; Pelella, A. ; Wu, P.</creator><creatorcontrib>Reohr, W. ; Yuen Chan ; Plass, D. ; Pelella, A. ; Wu, P.</creatorcontrib><description>SRAM designers and product engineers must balance the diverse aspects involved in developing and manufacturing quality ICs. This paper describes how cost and complexity design techniques to improve burn-in, noting implications for performance, power and density.< ></description><identifier>ISBN: 9780818638305</identifier><identifier>ISBN: 0818638303</identifier><identifier>DOI: 10.1109/VTEST.1993.313330</identifier><language>eng</language><publisher>IEEE Comput. Soc. Press</publisher><subject>Aging ; Built-in self-test ; Chip scale packaging ; Circuit testing ; Compressors ; Conductors ; Costs ; Heating ; Ovens ; Random access memory</subject><ispartof>Digest of Papers Eleventh Annual 1993 IEEE VLSI Test Symposium, 1993, p.164-170</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/313330$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,776,780,785,786,2051,4035,4036,27904,54899</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/313330$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Reohr, W.</creatorcontrib><creatorcontrib>Yuen Chan</creatorcontrib><creatorcontrib>Plass, D.</creatorcontrib><creatorcontrib>Pelella, A.</creatorcontrib><creatorcontrib>Wu, P.</creatorcontrib><title>Design SRAMs for burn-in</title><title>Digest of Papers Eleventh Annual 1993 IEEE VLSI Test Symposium</title><addtitle>VTEST</addtitle><description>SRAM designers and product engineers must balance the diverse aspects involved in developing and manufacturing quality ICs. This paper describes how cost and complexity design techniques to improve burn-in, noting implications for performance, power and density.< ></description><subject>Aging</subject><subject>Built-in self-test</subject><subject>Chip scale packaging</subject><subject>Circuit testing</subject><subject>Compressors</subject><subject>Conductors</subject><subject>Costs</subject><subject>Heating</subject><subject>Ovens</subject><subject>Random access memory</subject><isbn>9780818638305</isbn><isbn>0818638303</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>1993</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNpjYJA0NNAzNDSw1A8LcQ0O0TO0tDTWMzY0NjY2YGbgtTS3MLAwtDAztjA2MOVg4C0uzjIAAhMTY3NjA04GCZfU4sz0PIXgIEffYoW0_CKFpNKiPN3MPB4G1rTEnOJUXijNzSDl5hri7KGbmZqaGl9QlJmbWFQZD7HGGK8kANRQKVw</recordid><startdate>1993</startdate><enddate>1993</enddate><creator>Reohr, W.</creator><creator>Yuen Chan</creator><creator>Plass, D.</creator><creator>Pelella, A.</creator><creator>Wu, P.</creator><general>IEEE Comput. Soc. Press</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>1993</creationdate><title>Design SRAMs for burn-in</title><author>Reohr, W. ; Yuen Chan ; Plass, D. ; Pelella, A. ; Wu, P.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-ieee_primary_3133303</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>1993</creationdate><topic>Aging</topic><topic>Built-in self-test</topic><topic>Chip scale packaging</topic><topic>Circuit testing</topic><topic>Compressors</topic><topic>Conductors</topic><topic>Costs</topic><topic>Heating</topic><topic>Ovens</topic><topic>Random access memory</topic><toplevel>online_resources</toplevel><creatorcontrib>Reohr, W.</creatorcontrib><creatorcontrib>Yuen Chan</creatorcontrib><creatorcontrib>Plass, D.</creatorcontrib><creatorcontrib>Pelella, A.</creatorcontrib><creatorcontrib>Wu, P.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Reohr, W.</au><au>Yuen Chan</au><au>Plass, D.</au><au>Pelella, A.</au><au>Wu, P.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Design SRAMs for burn-in</atitle><btitle>Digest of Papers Eleventh Annual 1993 IEEE VLSI Test Symposium</btitle><stitle>VTEST</stitle><date>1993</date><risdate>1993</risdate><spage>164</spage><epage>170</epage><pages>164-170</pages><isbn>9780818638305</isbn><isbn>0818638303</isbn><abstract>SRAM designers and product engineers must balance the diverse aspects involved in developing and manufacturing quality ICs. This paper describes how cost and complexity design techniques to improve burn-in, noting implications for performance, power and density.< ></abstract><pub>IEEE Comput. Soc. Press</pub><doi>10.1109/VTEST.1993.313330</doi></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | ISBN: 9780818638305 |
| ispartof | Digest of Papers Eleventh Annual 1993 IEEE VLSI Test Symposium, 1993, p.164-170 |
| issn | |
| language | eng |
| recordid | cdi_ieee_primary_313330 |
| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | Aging Built-in self-test Chip scale packaging Circuit testing Compressors Conductors Costs Heating Ovens Random access memory |
| title | Design SRAMs for burn-in |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-22T10%3A19%3A41IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-ieee_6IE&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=Design%20SRAMs%20for%20burn-in&rft.btitle=Digest%20of%20Papers%20Eleventh%20Annual%201993%20IEEE%20VLSI%20Test%20Symposium&rft.au=Reohr,%20W.&rft.date=1993&rft.spage=164&rft.epage=170&rft.pages=164-170&rft.isbn=9780818638305&rft.isbn_list=0818638303&rft_id=info:doi/10.1109/VTEST.1993.313330&rft_dat=%3Cieee_6IE%3E313330%3C/ieee_6IE%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=313330&rfr_iscdi=true |