Development of novel architecture and assembly techniques for a detector unit for a silicon micro-vertex detector using the flip-chip bonding method

Development of novel architecture and assembly techniques for a detector unit for a silicon micro-vertex detector using the flip-chip bonding method

Full-size models of a detector unit for a silicon microvertex detector for the KEK B factory have been built. The model consists of four dummy double-sided, double-metal silicon microstrip detectors and two silicon end-boards mounted with dummy readout VLSIs on both sides. In this trial the flip-chi...

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Hauptverfasser: Saitoh, Y., Yamanaka, J., Suzuki, H., Miyahara, S., Kamiya, M., Kadoi, K., Masusda, T., Maemura, K., Inoue, M., Suzuki, A., Takeuchi, H., Mandai, M., Kanazawa, H., Higashi, Y., Ikeda, H., Koike, S., Matsuda, T., Ozaki, H., Tanaka, M., Tsuboyama, T., Avrillon, S., Okuno, S., Haba, J., Hamai, H., Mori, S., Yusa, K.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Anisotropic conductive films
Assembly
Bonding
Bridges
Decision support systems
Detectors
Silicon
Strips
Very large scale integration
Wire
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Beschreibung
Zusammenfassung:Full-size models of a detector unit for a silicon microvertex detector for the KEK B factory have been built. The model consists of four dummy double-sided, double-metal silicon microstrip detectors and two silicon end-boards mounted with dummy readout VLSIs on both sides. In this trial the flip-chip bonding method, using an anisotropic conductive film, is applied to both sides of the detector unit to bond 640 strips at a pitch of 50 mu m.< >
DOI:10.1109/NSSMIC.1992.301207