Fine-grained polysilicon films with built-in tensile strain

Fine-grained polysilicon films with built-in tensile strain

Novel processing conditions and strain diagnostic structures are used to demonstrate that polysilicon films with built-in tensile-strain can be achieved and that any physical size limitations due to compressive-buckling in polysilicon micromechanical structures can be eliminated.< >

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Bibliographische Detailangaben
Veröffentlicht in:IEEE transactions on electron devices 1988-06, Vol.35 (6), p.800-801
Hauptverfasser: Guckel, H., Burns, D.W., Visser, C.C.G., Tilmans, H.A.C., Deroo, D.
Format: Artikel
Sprache:eng
Schlagworte:
Annealing
Building materials
Capacitive sensors
Geometry
Micromechanical devices
Strain measurement
Structural beams
Tensile strain
Testing
Transistors
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Beschreibung
Zusammenfassung:Novel processing conditions and strain diagnostic structures are used to demonstrate that polysilicon films with built-in tensile-strain can be achieved and that any physical size limitations due to compressive-buckling in polysilicon micromechanical structures can be eliminated.< >
ISSN:0018-9383
1557-9646
DOI:10.1109/16.2534