Impact of MCMs on system performance optimization

Impact of MCMs on system performance optimization

Presents a performance model for the University of Michigan MCM (multichip module)-based GaAs microcomputer. The model takes into account architectural as well as MCM packaging considerations such as the chip-to-substrate bonding method, the dielectric constant of the insulator, and the resistivity...

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Bibliographische Detailangaben
Hauptverfasser: Kayssi, A.I., Sakallah, K.A., Brown, R.B., Lomax, R.J., Mudge, T.N., Huff, T.R.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Bonding
Conductivity
Conductors
Dielectric constant
Dielectrics and electrical insulation
Gallium arsenide
Metal-insulator structures
Microcomputers
Packaging
System performance
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Beschreibung
Zusammenfassung:Presents a performance model for the University of Michigan MCM (multichip module)-based GaAs microcomputer. The model takes into account architectural as well as MCM packaging considerations such as the chip-to-substrate bonding method, the dielectric constant of the insulator, and the resistivity of the metal conductor. The authors illustrate the use of the model by finding the I-cache size which maximizes the MIPS (millions of instructions per second) rating for given MCM technology parameters.< >
DOI:10.1109/ISCAS.1992.230071