The impact of new applications on thermal properties data requirements (electronic packages)
The various thermal parameters affecting the design and performance of electronics packages, using materials in these forms, are discussed. They are illustrated with results obtained on different materials and combinations using several new or modified techniques developed specifically to measure ap...
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| creator | Tye, R.P. Maesono, A. |
| description | The various thermal parameters affecting the design and performance of electronics packages, using materials in these forms, are discussed. They are illustrated with results obtained on different materials and combinations using several new or modified techniques developed specifically to measure appropriate properties of small specimen configurations. These include: the measurement of thermal expansion of small specimens to very high precision, enabling improved matching of composite wafers and components to be attained; the measurement of specific heat of thin films to high precision, enabling development of improved superconductor materials; and the measurement of thermal diffusivity of materials and multilayered composites. The effect of various parameters is discussed, including difference in property from that of the bulk solid, anisotropy in property, and homogeneity and uniformity.< > |
| doi_str_mv | 10.1109/ITHERM.1992.187770 |
| format | Conference Proceeding |
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The effect of various parameters is discussed, including difference in property from that of the bulk solid, anisotropy in property, and homogeneity and uniformity.< ></description><identifier>ISBN: 9780780305038</identifier><identifier>ISBN: 0780305035</identifier><identifier>DOI: 10.1109/ITHERM.1992.187770</identifier><language>eng</language><publisher>IEEE</publisher><subject>Composite materials ; Conducting materials ; Electronic packaging thermal management ; Laser beams ; Optical interferometry ; Semiconductor device packaging ; Solids ; Superconducting materials ; Thermal conductivity ; Thermal expansion</subject><ispartof>[1992 Proceedings] Intersociety Conference on Thermal Phenomena in Electronic Systems, 1992, p.253-256</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/187770$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,780,784,789,790,2058,4050,4051,27925,54920</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/187770$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Tye, R.P.</creatorcontrib><creatorcontrib>Maesono, A.</creatorcontrib><title>The impact of new applications on thermal properties data requirements (electronic packages)</title><title>[1992 Proceedings] Intersociety Conference on Thermal Phenomena in Electronic Systems</title><addtitle>ITHERM</addtitle><description>The various thermal parameters affecting the design and performance of electronics packages, using materials in these forms, are discussed. They are illustrated with results obtained on different materials and combinations using several new or modified techniques developed specifically to measure appropriate properties of small specimen configurations. These include: the measurement of thermal expansion of small specimens to very high precision, enabling improved matching of composite wafers and components to be attained; the measurement of specific heat of thin films to high precision, enabling development of improved superconductor materials; and the measurement of thermal diffusivity of materials and multilayered composites. The effect of various parameters is discussed, including difference in property from that of the bulk solid, anisotropy in property, and homogeneity and uniformity.< ></description><subject>Composite materials</subject><subject>Conducting materials</subject><subject>Electronic packaging thermal management</subject><subject>Laser beams</subject><subject>Optical interferometry</subject><subject>Semiconductor device packaging</subject><subject>Solids</subject><subject>Superconducting materials</subject><subject>Thermal conductivity</subject><subject>Thermal expansion</subject><isbn>9780780305038</isbn><isbn>0780305035</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>1992</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNotkE1LAzEYhAMiKHX_QE856mHXJLvZJEcp1RYqguxRKPl4Y6P7ZRIR_70LdRiYmctzGITWlFSUEnW_73bb1-eKKsUqKoUQ5AIVSkiyuCac1PIKFSl9kEUNp4zRa_TWnQCHYdY248njEX6wnuc-WJ3DNCY8jTifIA66x3OcZog5QMJOZ40jfH2HCAOMOeFb6MHmOI3B4gX2qd8h3d2gS6_7BMV_rlD3uO02u_Lw8rTfPBzKIEUuNTGSmbYR0jbeE-OY8lrZVjrCOTfG1o1ToNRSgbbLYGCc9IIrR5Q3rl6h9RkbAOA4xzDo-Hs8P1D_AckPVBY</recordid><startdate>1992</startdate><enddate>1992</enddate><creator>Tye, R.P.</creator><creator>Maesono, A.</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>1992</creationdate><title>The impact of new applications on thermal properties data requirements (electronic packages)</title><author>Tye, R.P. ; Maesono, A.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i87t-a0b82b6478c4ff0bd29fa9c68d0555bbc34d9e995bbe1634d2ebd8f759d09fbd3</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>1992</creationdate><topic>Composite materials</topic><topic>Conducting materials</topic><topic>Electronic packaging thermal management</topic><topic>Laser beams</topic><topic>Optical interferometry</topic><topic>Semiconductor device packaging</topic><topic>Solids</topic><topic>Superconducting materials</topic><topic>Thermal conductivity</topic><topic>Thermal expansion</topic><toplevel>online_resources</toplevel><creatorcontrib>Tye, R.P.</creatorcontrib><creatorcontrib>Maesono, A.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Tye, R.P.</au><au>Maesono, A.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>The impact of new applications on thermal properties data requirements (electronic packages)</atitle><btitle>[1992 Proceedings] Intersociety Conference on Thermal Phenomena in Electronic Systems</btitle><stitle>ITHERM</stitle><date>1992</date><risdate>1992</risdate><spage>253</spage><epage>256</epage><pages>253-256</pages><isbn>9780780305038</isbn><isbn>0780305035</isbn><abstract>The various thermal parameters affecting the design and performance of electronics packages, using materials in these forms, are discussed. They are illustrated with results obtained on different materials and combinations using several new or modified techniques developed specifically to measure appropriate properties of small specimen configurations. These include: the measurement of thermal expansion of small specimens to very high precision, enabling improved matching of composite wafers and components to be attained; the measurement of specific heat of thin films to high precision, enabling development of improved superconductor materials; and the measurement of thermal diffusivity of materials and multilayered composites. The effect of various parameters is discussed, including difference in property from that of the bulk solid, anisotropy in property, and homogeneity and uniformity.< ></abstract><pub>IEEE</pub><doi>10.1109/ITHERM.1992.187770</doi><tpages>4</tpages></addata></record> |
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| identifier | ISBN: 9780780305038 |
| ispartof | [1992 Proceedings] Intersociety Conference on Thermal Phenomena in Electronic Systems, 1992, p.253-256 |
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| language | eng |
| recordid | cdi_ieee_primary_187770 |
| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | Composite materials Conducting materials Electronic packaging thermal management Laser beams Optical interferometry Semiconductor device packaging Solids Superconducting materials Thermal conductivity Thermal expansion |
| title | The impact of new applications on thermal properties data requirements (electronic packages) |
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