The impact of new applications on thermal properties data requirements (electronic packages)

The various thermal parameters affecting the design and performance of electronics packages, using materials in these forms, are discussed. They are illustrated with results obtained on different materials and combinations using several new or modified techniques developed specifically to measure appropriate properties of small specimen configurations. These include: the measurement of thermal expansion of small specimens to very high precision, enabling improved matching of composite wafers and components to be attained; the measurement of specific heat of thin films to high precision, enabling development of improved superconductor materials; and the measurement of thermal diffusivity of materials and multilayered composites. The effect of various parameters is discussed, including difference in property from that of the bulk solid, anisotropy in property, and homogeneity and uniformity.< >