HASP-1002: a hybrid wafer scale associative string processor

HASP-1002: a hybrid wafer scale associative string processor

The authors introduce and evaluate a multichip module produced in hybrid-WSI (wafer scale integration) technology embedded for real-time signal and data processing. The benefits and potential of the technologies of the HASP-1002 hybrid-WSI device are shown. The combination of improvements of the siz...

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Bibliographische Detailangaben
Hauptverfasser: Jalowiecki, I.P., Reche, J.J., Habiger, C., Lea, R.M.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Application specific processors
Control systems
Data processing
Los Angeles Council
Multichip modules
Packaging machines
Parallel processing
Real time systems
Signal processing
Very large scale integration
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Beschreibung
Zusammenfassung:The authors introduce and evaluate a multichip module produced in hybrid-WSI (wafer scale integration) technology embedded for real-time signal and data processing. The benefits and potential of the technologies of the HASP-1002 hybrid-WSI device are shown. The combination of improvements of the size-performance and the cost-performance trade-offs underlines the vitality of hybrid-WSI technologies, as traditionally the cost-performance trade-off worsens for size and weight sensitive applications.< >
DOI:10.1109/ICWSI.1992.171803