Quantifying electric and magnetic field coupling from integrated circuits with TEM cell measurements

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Bibliographische Detailangaben
Hauptverfasser:	Kasturi, V., Deng, S., Hubing, T., Beetner, D.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Coupling circuits Electric variables measurement Electromagnetic compatibility Electromagnetic measurements Integrated circuit measurements Integrated circuit packaging Magnetic field measurement Magnetic fields TEM cells Voltage
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