Modeling of hierarchical power/ground network based on segmentation method for package/board co-design and simulation

Hierarchical power/ground network is the most common structure in system, however it is hard to extract the impedance property of it, because of the interaction between structures in system, such as package and board. With resonant cavity model, segmentation method and two proposed issues on hierarc...

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Hauptverfasser:	Jaemin Kim, Youchul Jeong, Jingook Kim, Junho Lee, Jongjoo Shim, Kim, Joungho
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Frequency domain analysis fringing effect hierarchical power/ground network Impedance Integrated circuit packaging inter-plane effect method Power supplies Power system interconnection Power system modeling Power system reliability Resonance resonant cavity model segmentation
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Beschreibung
Zusammenfassung:	Hierarchical power/ground network is the most common structure in system, however it is hard to extract the impedance property of it, because of the interaction between structures in system, such as package and board. With resonant cavity model, segmentation method and two proposed issues on hierarchical network, we can find out the total impedance of system. The result has been verified by comparing with the result of 3D full wave simulation in frequency domain.
ISSN:	2158-110X 2158-1118
DOI:	10.1109/ISEMC.2006.1706254