Enhanced Performance of PMOS MUGFET via Integration of Conformal Plasma-Doped Source/Drain Extensions

For the first time, scaled PMOS MUGFET devices with TiCN/HfO 2 gate stack is doped with specific pulsed plasma doping processes. This paper first highlights the key benefit brought by conformal source/drain extensions, demonstrates how pulsed plasma doping process can be tuned to conformal dope very...

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Hauptverfasser: Lenoble, D., Anil, K., De Keersgieter, A., Eybens, P., Collaert, N., Rooyackers, R., Brus, S., Zimmerman, P., Goodwin, M., Vanhaeren, D., Vandervorst, W., Radovanov, S., Godet, L., Cardinaud, C., Biesemans, S., Skotnicki, T., Jurczak, M.
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creator Lenoble, D.
Anil, K.
De Keersgieter, A.
Eybens, P.
Collaert, N.
Rooyackers, R.
Brus, S.
Zimmerman, P.
Goodwin, M.
Vanhaeren, D.
Vandervorst, W.
Radovanov, S.
Godet, L.
Cardinaud, C.
Biesemans, S.
Skotnicki, T.
Jurczak, M.
description For the first time, scaled PMOS MUGFET devices with TiCN/HfO 2 gate stack is doped with specific pulsed plasma doping processes. This paper first highlights the key benefit brought by conformal source/drain extensions, demonstrates how pulsed plasma doping process can be tuned to conformal dope very dense fin structures and finally shows that high performance (+24% vs. ion implant reference) multi-gate pMOS device (720 μA/μm @ I off 20nA/μm, at V ds = -1.2V) is achieved with extensions formed by optimized PLAD process
doi_str_mv 10.1109/VLSIT.2006.1705270
format Conference Proceeding
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source IEEE Electronic Library (IEL) Conference Proceedings
subjects Annealing
Cathodes
Doping
Hafnium oxide
Implants
Ion beams
Plasma density
Plasma devices
Plasma immersion ion implantation
Plasma sources
title Enhanced Performance of PMOS MUGFET via Integration of Conformal Plasma-Doped Source/Drain Extensions
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