Hafnium silicate nanocrystal memory using sol-gel-spin-coating method

The authors fabricate the hafnium silicate nanocrystal memory for the first time using a very simple sol-gel-spin-coating method and 900 degC 1-min rapid thermal annealing (RTA). From the TEM identification, the nanocrystals are formed as the charge trapping layer after 900 degC 1-min RTA and the si...

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Veröffentlicht in:IEEE electron device letters 2006-08, Vol.27 (8), p.644-646
Hauptverfasser: YOU, Hsin-Chiang, HSU, Tze-Hsiang, KO, Fu-Hsiang, HUANG, Jiang-Wen, LEI, Tan-Fu
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Sprache:eng
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Zusammenfassung:The authors fabricate the hafnium silicate nanocrystal memory for the first time using a very simple sol-gel-spin-coating method and 900 degC 1-min rapid thermal annealing (RTA). From the TEM identification, the nanocrystals are formed as the charge trapping layer after 900 degC 1-min RTA and the size is about 5 nm. They demonstrate the composition of nanocrystal is hafnium silicate from the X-ray-photoelectron-spectroscopy analysis. They verify the electric properties in terms of program/erase (P/E) speed, charge retention, and endurance. The sol-gel device exhibits the long charge retention time of 10 4 s with only 6% charge loss, and good endurance performance for P/E cycles up to 10 5
ISSN:0741-3106
1558-0563
DOI:10.1109/LED.2006.879022