Incorporating SIMS Structures in Product Wafers in Order to Perform SIMS and other Material Analysis and Achieve Wafer Level Information about the Front-End Processing

Incorporating SIMS Structures in Product Wafers in Order to Perform SIMS and other Material Analysis and Achieve Wafer Level Information about the Front-End Processing

In this paper, we summarize how the introduction of SIMS structures near the global alignment marks of product wafers serve as an additional way to acquire detailed analytical information about front-end processing and can minimize product yield loss without waiting for metal 1 processing when elect...

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Hauptverfasser: Budri, T., Krott, L., Patel, N., Smith, A., Gurcan, B., Crocker, K., Supczak, R., Printy, C.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Electron beams
Implants
Information analysis
Performance analysis
Probes
Semiconductor materials
Silicon germanium
Substrates
Testing
Transistors
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Zusammenfassung:In this paper, we summarize how the introduction of SIMS structures near the global alignment marks of product wafers serve as an additional way to acquire detailed analytical information about front-end processing and can minimize product yield loss without waiting for metal 1 processing when electrical testing (ET) becomes possible
ISSN:1078-8743
2376-6697
DOI:10.1109/ASMC.2006.1638717