Novel ultra-low power RF Lateral BJT on SOI-CMOS compatible substrate

This work presents a novel ultra-low power RF LBJT on SOI. The fabrication process relies on polysilicon side-wall-spacer (PSWS) to self-aligned the base contact to the intrinsic base in the 100 nm range. The fabricated LBJTs exhibits superior Johnson's product (f τ x BV CEO ) in the range betw...

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Hauptverfasser: Sun, I.-S.M., Wai Tung Ng, Mochizuki, H., Kanekiyo, K., Kobayashi, T., Toita, M., Imai, H., Ishikawa, A., Tamura, S., Takasuka, K.
Format: Tagungsbericht
Sprache:eng
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Zusammenfassung:This work presents a novel ultra-low power RF LBJT on SOI. The fabrication process relies on polysilicon side-wall-spacer (PSWS) to self-aligned the base contact to the intrinsic base in the 100 nm range. The fabricated LBJTs exhibits superior Johnson's product (f τ x BV CEO ) in the range between 190-300 GHz.V. The f max of the optimal device reaches 46 GHz at collector current density of only 0.15 m/μm 2 . Both figure-of-merit are in-line with advanced SiGe-HBT device, and superior than previously published data on lateral BJTs. This LBJT is built on SOI-CMOS compatible substrate, and is an ideal candidate for SOI-BiCMOS integration for RF and mixed-signal SoC.
DOI:10.1109/EDSSC.2005.1635271