Photonic packaging for optical communications systems-basics and applications

Photonic packaging for optical communications systems-basics and applications

In this report, different fiber-chip coupling concepts are presented. Automated coupling process, as well as different modules for laser welding, gluing and mechanical fixation are also discussed. Thermal stress tests are reported

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Bibliographische Detailangaben
1. Verfasser: Fischer-Hirchert, U.H.P.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Circuit testing
High speed optical techniques
Optical fiber communication
Optical fiber devices
Optical fiber networks
Optical fiber theory
Optical modulation
Optical receivers
Optical transmitters
Packaging
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Beschreibung
Zusammenfassung:In this report, different fiber-chip coupling concepts are presented. Automated coupling process, as well as different modules for laser welding, gluing and mechanical fixation are also discussed. Thermal stress tests are reported
ISSN:1939-4381
2576-9405
DOI:10.1109/STYSW.2005.1617791