Vorpal as a Tool for Three-Dimensional Simulations of Multipacting in Superconducting RF Cavities

Considerable resources are required to run three dimensional simulations of multipacting in superconducting radio frequency cavities. Three dimensional simulations are needed to understand the possible roles of non-axisymmetric features such as the power couplers. Such simulations require the abilit...

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Hauptverfasser: Nieter, C., Stoltz, P.H., Cary, J.R., Werner, G.R.
Format: Tagungsbericht
Sprache:eng
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Zusammenfassung:Considerable resources are required to run three dimensional simulations of multipacting in superconducting radio frequency cavities. Three dimensional simulations are needed to understand the possible roles of non-axisymmetric features such as the power couplers. Such simulations require the ability to run in parallel. We consider the versatile plasma simulation code VORPAL as a possible platform to study such effects. VORPAL has a general 3D domain decomposition and can run in any physical dimension. VORPAL uses the CMEE library to model the secondary emission of electrons from metal surfaces. We present a three dimensional simulation of a simple pillbox RF cavity to demonstrate the potential of VORPAL to be a major simulation tool for superconducting radio frequency (SRF) cavities.
ISSN:1944-4680
2152-9582
DOI:10.1109/PAC.2005.1591812