IEEE Std 1500 Compliant Infrastructure forModular SOC Testing
Modern semiconductor process technologies enable the manufacturing of a complete system on one single die, the so-called system-on-chip or SOC. Building those chips in a timely and cost-effective manner is amongst others realized by embedding third-party IP cores. Due to imperfections in silicon man...
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Format: | Tagungsbericht |
Sprache: | eng |
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Zusammenfassung: | Modern semiconductor process technologies enable the manufacturing of a complete system on one single die, the so-called system-on-chip or SOC. Building those chips in a timely and cost-effective manner is amongst others realized by embedding third-party IP cores. Due to imperfections in silicon manufacturing, an SOC including all its embedded modules needs to be tested for manufacturing defects. |
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ISSN: | 1081-7735 2377-5386 |
DOI: | 10.1109/ATS.2005.67 |