IEEE Std 1500 Compliant Infrastructure forModular SOC Testing

Modern semiconductor process technologies enable the manufacturing of a complete system on one single die, the so-called system-on-chip or SOC. Building those chips in a timely and cost-effective manner is amongst others realized by embedding third-party IP cores. Due to imperfections in silicon man...

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Bibliographische Detailangaben
Hauptverfasser: Waayers, T., Marinissen, E.J., Lousberg, M.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:Modern semiconductor process technologies enable the manufacturing of a complete system on one single die, the so-called system-on-chip or SOC. Building those chips in a timely and cost-effective manner is amongst others realized by embedding third-party IP cores. Due to imperfections in silicon manufacturing, an SOC including all its embedded modules needs to be tested for manufacturing defects.
ISSN:1081-7735
2377-5386
DOI:10.1109/ATS.2005.67