On-chip temperature control circuit using common devices

On-chip temperature control circuit using common devices

A circuit has been designed to control the temperature of the IC die upon which it resides. No special devices or layers are required. No external circuitry or special heat sinking is used. Equilibrium temperatures from below -40/spl deg/C to above +85/spl deg/C are attainable. Time to equilibrium i...

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Bibliographische Detailangaben
Hauptverfasser: Braun, F.D., Parent, D.W., Papalias, T.A.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Circuit testing
Diodes
Electronics packaging
Heating
Impedance
Negative feedback
Operational amplifiers
Temperature control
Temperature distribution
Voltage
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Beschreibung
Zusammenfassung:A circuit has been designed to control the temperature of the IC die upon which it resides. No special devices or layers are required. No external circuitry or special heat sinking is used. Equilibrium temperatures from below -40/spl deg/C to above +85/spl deg/C are attainable. Time to equilibrium is on the order of a few seconds. The 400/spl mu/m /spl times/ 500/spl mu/m circuit has been manufactured by the MOSIS service in a TSMC 0.25 micron process and installed in a 40-pin DIP package. Test results reveal temperature regulation within 0.3/spl deg/C for thermal control ranges of 4/spl deg/C to 40/spl deg/C.
ISSN:0886-5930
2152-3630
DOI:10.1109/CICC.2005.1568645