Solutions to optoelectronic packaging problems

Solutions to optoelectronic packaging problems

Optoelectronic bonding has been performed onto sample MCMs (multi-chip modules), which are to be used for optical testing for the high-speed optoelectronic memory systems [HOLMS] demonstrator. This was conducted on an FC6 bonder using the flip chip bonding process.

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Bibliographische Detailangaben
Hauptverfasser: Kumpatla, S., Casswell, J.J., Snowdon, J.F.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Bonding
Flip chip
Footwear
High speed optical techniques
Optical receivers
Optical sensors
Packaging
Performance evaluation
Testing
Vertical cavity surface emitting lasers
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Beschreibung
Zusammenfassung:Optoelectronic bonding has been performed onto sample MCMs (multi-chip modules), which are to be used for optical testing for the high-speed optoelectronic memory systems [HOLMS] demonstrator. This was conducted on an FC6 bonder using the flip chip bonding process.
DOI:10.1109/CLEOE.2005.1568273