Hybrid packaging technique for high power density circuit

Hybrid packaging technique for high power density circuit

Downsizing or miniaturizing power circuits for the 1990's power conversion technologies requires high and very high power density (greater than 100 watt/in/sup 3/) packaging capability. Among different packaging techniques, the hybrid packaging technique is preferred for many applications becau...

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Hauptverfasser: Ngon Binh Nguyen, Jones, F.B.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Bonding
Copper
Electronic packaging thermal management
Power conversion
Power dissipation
Switches
Switching circuits
Temperature
Thermal management
Thermal resistance
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Jones, F.B.
description Downsizing or miniaturizing power circuits for the 1990's power conversion technologies requires high and very high power density (greater than 100 watt/in/sup 3/) packaging capability. Among different packaging techniques, the hybrid packaging technique is preferred for many applications because it has a good reliability history. This technique utilizes newly developed processes and materials such as direct bonded copper and diamond coated substrates to significantly improve thermal management and achieve optimal thermal resistance (less than 0.4 degrees C/watt). A 124 watt/cm/sup 2/ (800 watt/in/sup 2/) power density hybrid packaging example is presented here. The results of thermal design and evaluation of this hybrid are discussed.< >
doi_str_mv 10.1109/STHERM.1991.152922
format Conference Proceeding
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The results of thermal design and evaluation of this hybrid are discussed.&lt; &gt;</description><subject>Bonding</subject><subject>Copper</subject><subject>Electronic packaging thermal management</subject><subject>Power conversion</subject><subject>Power dissipation</subject><subject>Switches</subject><subject>Switching circuits</subject><subject>Temperature</subject><subject>Thermal management</subject><subject>Thermal resistance</subject><isbn>0879426640</isbn><isbn>9780879426644</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>1991</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNotj8tKw0AYRgdEUGtfoKt5gcT555bMUko1QkXQui5z-ScZL2mcpEje3kL9Nmd3OB8hK2AlADN3b7tm8_pcgjFQguKG8wtyw-rKSK61ZFdkOY4f7DSpQBtzTUwzu5wCHaz_tG3qWzqh7_r0c0QaD5l2qe3ocPjFTAP2Y5pm6lP2xzTdkstov0Zc_nNB3h82u3VTbF8en9b32yJBxadCW-9EMIEH1CgwRBG9t7UM8RTElRfM1cxa56UOykWroJaghKq5hBgqLRZkdfYmRNwPOX3bPO_P58QfSYZGbw</recordid><startdate>1991</startdate><enddate>1991</enddate><creator>Ngon Binh Nguyen</creator><creator>Jones, F.B.</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>1991</creationdate><title>Hybrid packaging technique for high power density circuit</title><author>Ngon Binh Nguyen ; Jones, F.B.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i172t-6acb3d9d2de6e3edf3fcca84df66425c30b80aabc46d5bfa518415358241fd763</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>1991</creationdate><topic>Bonding</topic><topic>Copper</topic><topic>Electronic packaging thermal management</topic><topic>Power conversion</topic><topic>Power dissipation</topic><topic>Switches</topic><topic>Switching circuits</topic><topic>Temperature</topic><topic>Thermal management</topic><topic>Thermal resistance</topic><toplevel>online_resources</toplevel><creatorcontrib>Ngon Binh Nguyen</creatorcontrib><creatorcontrib>Jones, F.B.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Ngon Binh Nguyen</au><au>Jones, F.B.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Hybrid packaging technique for high power density circuit</atitle><btitle>1991 Proceedings, Seventh IEEE Semiconductor Thermal Measurement and Management Symposium</btitle><stitle>STHERM</stitle><date>1991</date><risdate>1991</risdate><spage>105</spage><epage>109</epage><pages>105-109</pages><isbn>0879426640</isbn><isbn>9780879426644</isbn><abstract>Downsizing or miniaturizing power circuits for the 1990's power conversion technologies requires high and very high power density (greater than 100 watt/in/sup 3/) packaging capability. Among different packaging techniques, the hybrid packaging technique is preferred for many applications because it has a good reliability history. This technique utilizes newly developed processes and materials such as direct bonded copper and diamond coated substrates to significantly improve thermal management and achieve optimal thermal resistance (less than 0.4 degrees C/watt). A 124 watt/cm/sup 2/ (800 watt/in/sup 2/) power density hybrid packaging example is presented here. The results of thermal design and evaluation of this hybrid are discussed.&lt; &gt;</abstract><pub>IEEE</pub><doi>10.1109/STHERM.1991.152922</doi><tpages>5</tpages></addata></record>
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identifier ISBN: 0879426640
ispartof 1991 Proceedings, Seventh IEEE Semiconductor Thermal Measurement and Management Symposium, 1991, p.105-109
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source IEEE Electronic Library (IEL) Conference Proceedings
subjects Bonding
Copper
Electronic packaging thermal management
Power conversion
Power dissipation
Switches
Switching circuits
Temperature
Thermal management
Thermal resistance
title Hybrid packaging technique for high power density circuit
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