Hybrid packaging technique for high power density circuit

Downsizing or miniaturizing power circuits for the 1990's power conversion technologies requires high and very high power density (greater than 100 watt/in/sup 3/) packaging capability. Among different packaging techniques, the hybrid packaging technique is preferred for many applications because it has a good reliability history. This technique utilizes newly developed processes and materials such as direct bonded copper and diamond coated substrates to significantly improve thermal management and achieve optimal thermal resistance (less than 0.4 degrees C/watt). A 124 watt/cm/sup 2/ (800 watt/in/sup 2/) power density hybrid packaging example is presented here. The results of thermal design and evaluation of this hybrid are discussed.< >