W-band flip-chip VCO in thin-film environment

A flip-chip packaging approach for W-band GaAs chips is presented using thin-film structures on silicon as carrier substrate. Reliability investigations indicate that, depending on bump size, the CTE mismatch is not critical and an underfiller does not provide distinctive benefits. A 77 GHz VCO GaAs...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Schmuckle, F.J., Lenk, F., Hutter, M., Klein, M., Oppermann, H., Engelmann, G., Topper, M., Riepe, K., Heinrich, W.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Frequency Gallium arsenide Gold MMICs Packaging Semiconductor thin films Substrates Tin Transistors Voltage-controlled oscillators
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