W-band flip-chip VCO in thin-film environment

W-band flip-chip VCO in thin-film environment

A flip-chip packaging approach for W-band GaAs chips is presented using thin-film structures on silicon as carrier substrate. Reliability investigations indicate that, depending on bump size, the CTE mismatch is not critical and an underfiller does not provide distinctive benefits. A 77 GHz VCO GaAs...

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Bibliographische Detailangaben
Hauptverfasser: Schmuckle, F.J., Lenk, F., Hutter, M., Klein, M., Oppermann, H., Engelmann, G., Topper, M., Riepe, K., Heinrich, W.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Frequency
Gallium arsenide
Gold
MMICs
Packaging
Semiconductor thin films
Substrates
Tin
Transistors
Voltage-controlled oscillators
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Beschreibung
Zusammenfassung:A flip-chip packaging approach for W-band GaAs chips is presented using thin-film structures on silicon as carrier substrate. Reliability investigations indicate that, depending on bump size, the CTE mismatch is not critical and an underfiller does not provide distinctive benefits. A 77 GHz VCO GaAs-HBT MMIC is flip-chip-mounted to demonstrate validity of the packaging scheme.
ISSN:0149-645X
2576-7216
DOI:10.1109/MWSYM.2005.1516837