Process check time reduction by the application of an in-line thin film thickness measurement tool

Efficient improvement of productivity is required for the semiconductor fabrication line. It is very effective to reduce the PC(process check) time for efficiency improvement of productivity. To reduce PC time, we evaluated the in-line thin film thickness measurement tool. The result of the application of the in-line thin film thickness measurement tool, we succeeded to reduce RESIST and BARC film thickness inspection time dramatically as compared with the conventional film thickness inspection time, and proved that the investment efficiency of RESIST and BARC film thickness control was improved