Damage-free wafer cleaning by water and gas mixture jet

Damage-free wafer cleaning by water and gas mixture jet

A damage-free single wafer cleaning method using a water and gas mixture jet (two-fluid jet) has been developed. It was confirmed that the combination cleaning process of the two-fluid jet and APM (NH/sub 4/OH/H/sub 2/O/sub 2//DIW) dispense showed higher cleaning performance than that of conventiona...

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Bibliographische Detailangaben
Hauptverfasser: Hirota, Y., Kanno, I., Fujiwara, K., Nagayasu, H., Shimose, S.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Chemical processes
Costs
Electrons
Etching
Fluid flow
Large scale integration
Manufacturing processes
Surface cleaning
Temperature
Velocity control
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Beschreibung
Zusammenfassung:A damage-free single wafer cleaning method using a water and gas mixture jet (two-fluid jet) has been developed. It was confirmed that the combination cleaning process of the two-fluid jet and APM (NH/sub 4/OH/H/sub 2/O/sub 2//DIW) dispense showed higher cleaning performance than that of conventional batch-type APM cleaning for 65 nm gate patterns. The cleaning performance of the two-fluid jet was improved by adjusting the velocity distribution of water droplets. Two-fluid jet cleaning can also be applied to Cu interconnects processes.
ISSN:1523-553X
DOI:10.1109/ISSM.2005.1513340