Novel packaging of parallel-optical interconnects for high-end servers

A novel packaging concept is demonstrated where parallel-optical subassemblies are mounted on the same substrate as processor chips for processor-to-processor communication within a high-end server. A single-channel bit-error ratio

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Bibliographische Detailangaben
Hauptverfasser:	Rosenau, S.A., Simon, J., Windover, L.A.B., Law, B., Flower, G.M., DeGroot, E., Grot, A., Nystrom, M.J., Chao-Kun Lin, Tandon, A., Djordjev, K., Tan, M.R.T., Mirkarimi, L.W., Gruhlke, R.W., Hui Xia, Rankin, G., Ali, M.E., Lemoff, B.E., Giboney, K.S., Dolfi, D.W., Colgan, E.G., Furman, B., Magerlein, J., Schaub, J., Stigliani, D., Torok, J., Becker, D., Katopis, G., Dyckman, W., O'Connor, D.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Aggregates Bandwidth Connectors Design optimization Integrated circuit interconnections Laboratories Open source hardware Optical interconnections Packaging Routing
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Beschreibung
Zusammenfassung:	A novel packaging concept is demonstrated where parallel-optical subassemblies are mounted on the same substrate as processor chips for processor-to-processor communication within a high-end server. A single-channel bit-error ratio
DOI:	10.1109/OFC.2005.193028