Problems and preliminary trials in lead free soldering

From July 2006, the PCB assembly producers must exclude lead from the technology process. We present the results of preliminary experiments of Pb free soldering in mass production and deliberations concerning technological aspects of two types of soldering; wave soldering and reflow soldering. In th...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Falinski, W., Hackiewicz, H., Koziol, G., Borecki, J.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Assembly Coatings Consumer electronics Copper Environmentally friendly manufacturing techniques Lead Nitrogen Reflow soldering Temperature Tin
Online-Zugang:	Volltext bestellen
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