Problems and preliminary trials in lead free soldering

Problems and preliminary trials in lead free soldering

From July 2006, the PCB assembly producers must exclude lead from the technology process. We present the results of preliminary experiments of Pb free soldering in mass production and deliberations concerning technological aspects of two types of soldering; wave soldering and reflow soldering. In th...

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Bibliographische Detailangaben
Hauptverfasser: Falinski, W., Hackiewicz, H., Koziol, G., Borecki, J.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Assembly
Coatings
Consumer electronics
Copper
Environmentally friendly manufacturing techniques
Lead
Nitrogen
Reflow soldering
Temperature
Tin
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Beschreibung
Zusammenfassung:From July 2006, the PCB assembly producers must exclude lead from the technology process. We present the results of preliminary experiments of Pb free soldering in mass production and deliberations concerning technological aspects of two types of soldering; wave soldering and reflow soldering. In the case of wave soldering, the process was carried out in air and nitrogen environments. The article includes: analysis of lead free soldering process; analysis and determination of basic technological Pb free soldering problems; experimental results of lead free soldering; determination of preliminary Pb free soldering parameters; analysis of the results (cross-sections).
DOI:10.1109/ISSE.2004.1490379