Problems and preliminary trials in lead free soldering
From July 2006, the PCB assembly producers must exclude lead from the technology process. We present the results of preliminary experiments of Pb free soldering in mass production and deliberations concerning technological aspects of two types of soldering; wave soldering and reflow soldering. In th...
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| creator | Falinski, W. Hackiewicz, H. Koziol, G. Borecki, J. |
| description | From July 2006, the PCB assembly producers must exclude lead from the technology process. We present the results of preliminary experiments of Pb free soldering in mass production and deliberations concerning technological aspects of two types of soldering; wave soldering and reflow soldering. In the case of wave soldering, the process was carried out in air and nitrogen environments. The article includes: analysis of lead free soldering process; analysis and determination of basic technological Pb free soldering problems; experimental results of lead free soldering; determination of preliminary Pb free soldering parameters; analysis of the results (cross-sections). |
| doi_str_mv | 10.1109/ISSE.2004.1490379 |
| format | Conference Proceeding |
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We present the results of preliminary experiments of Pb free soldering in mass production and deliberations concerning technological aspects of two types of soldering; wave soldering and reflow soldering. In the case of wave soldering, the process was carried out in air and nitrogen environments. The article includes: analysis of lead free soldering process; analysis and determination of basic technological Pb free soldering problems; experimental results of lead free soldering; determination of preliminary Pb free soldering parameters; analysis of the results (cross-sections).</abstract><pub>IEEE</pub><doi>10.1109/ISSE.2004.1490379</doi></addata></record> |
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| identifier | ISBN: 9780780384224 |
| ispartof | 27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004, 2004, Vol.1, p.74-78 vol.1 |
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| language | eng |
| recordid | cdi_ieee_primary_1490379 |
| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | Assembly Coatings Consumer electronics Copper Environmentally friendly manufacturing techniques Lead Nitrogen Reflow soldering Temperature Tin |
| title | Problems and preliminary trials in lead free soldering |
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