White light interferometry, a method for optical 3D-inspection of advanced packages

White light interferometry is a measuring method to acquire the shape of 3D surfaces very accurately. The paper presents an analysis of white light interferometry for its applicability in sensors for the assembly process of advanced packages. Aspects of the realization and the practical use of this...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Schaulin, M., Wolter, K.J.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	and manufacturing technology Assembly Components Interference Microscopy Mirrors Optical interferometry Optical scattering Optical sensors packaging Semiconductor device packaging Shape measurement
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!