White light interferometry, a method for optical 3D-inspection of advanced packages
White light interferometry is a measuring method to acquire the shape of 3D surfaces very accurately. The paper presents an analysis of white light interferometry for its applicability in sensors for the assembly process of advanced packages. Aspects of the realization and the practical use of this...
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creator | Schaulin, M. Wolter, K.J. |
description | White light interferometry is a measuring method to acquire the shape of 3D surfaces very accurately. The paper presents an analysis of white light interferometry for its applicability in sensors for the assembly process of advanced packages. Aspects of the realization and the practical use of this measuring method for area array components are discussed. |
doi_str_mv | 10.1109/ISSE.2004.1490373 |
format | Conference Proceeding |
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Aspects of the realization and the practical use of this measuring method for area array components are discussed.</description><subject>and manufacturing technology</subject><subject>Assembly</subject><subject>Components</subject><subject>Interference</subject><subject>Microscopy</subject><subject>Mirrors</subject><subject>Optical interferometry</subject><subject>Optical scattering</subject><subject>Optical sensors</subject><subject>packaging</subject><subject>Semiconductor device packaging</subject><subject>Shape measurement</subject><isbn>9780780384224</isbn><isbn>0780384229</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2004</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNotj99KwzAYxQMiKLMPIN7kAWxN8sW0uZQ5dTDwogMvx9f8WaNbU9Ig7O2tbIcDv8O5OHAIuees4pzpp3XbrirBmKy41AxquCKFrhs2GxophLwhxTR9s1mgpVLqlrRffciOHsK-zzQM2SXvUjy6nE6PFOkc-mipj4nGMQeDBwqvZRim0Zkc4kCjp2h_cTDO0hHND-7ddEeuPR4mV1y4INu31Xb5UW4-39fLl00ZNMslSgXGcomKC62MAQEoLKCFzvtO6rlrECUTje7cs_HWe-is-Cf3qqthQR7Os8E5txtTOGI67S7P4Q8H5VBZ</recordid><startdate>2004</startdate><enddate>2004</enddate><creator>Schaulin, M.</creator><creator>Wolter, K.J.</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>2004</creationdate><title>White light interferometry, a method for optical 3D-inspection of advanced packages</title><author>Schaulin, M. ; Wolter, K.J.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i90t-a463cd14a61296cc323a2d3ad3bffb4996c8aa40289be5cfdff3bd2fdff1f6b73</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2004</creationdate><topic>and manufacturing technology</topic><topic>Assembly</topic><topic>Components</topic><topic>Interference</topic><topic>Microscopy</topic><topic>Mirrors</topic><topic>Optical interferometry</topic><topic>Optical scattering</topic><topic>Optical sensors</topic><topic>packaging</topic><topic>Semiconductor device packaging</topic><topic>Shape measurement</topic><toplevel>online_resources</toplevel><creatorcontrib>Schaulin, M.</creatorcontrib><creatorcontrib>Wolter, K.J.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Schaulin, M.</au><au>Wolter, K.J.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>White light interferometry, a method for optical 3D-inspection of advanced packages</atitle><btitle>27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004</btitle><stitle>ISSE</stitle><date>2004</date><risdate>2004</risdate><volume>1</volume><spage>42</spage><epage>46 vol.1</epage><pages>42-46 vol.1</pages><isbn>9780780384224</isbn><isbn>0780384229</isbn><abstract>White light interferometry is a measuring method to acquire the shape of 3D surfaces very accurately. The paper presents an analysis of white light interferometry for its applicability in sensors for the assembly process of advanced packages. Aspects of the realization and the practical use of this measuring method for area array components are discussed.</abstract><pub>IEEE</pub><doi>10.1109/ISSE.2004.1490373</doi></addata></record> |
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identifier | ISBN: 9780780384224 |
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language | eng |
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source | IEEE Electronic Library (IEL) Conference Proceedings |
subjects | and manufacturing technology Assembly Components Interference Microscopy Mirrors Optical interferometry Optical scattering Optical sensors packaging Semiconductor device packaging Shape measurement |
title | White light interferometry, a method for optical 3D-inspection of advanced packages |
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