White light interferometry, a method for optical 3D-inspection of advanced packages

White light interferometry is a measuring method to acquire the shape of 3D surfaces very accurately. The paper presents an analysis of white light interferometry for its applicability in sensors for the assembly process of advanced packages. Aspects of the realization and the practical use of this...

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Hauptverfasser: Schaulin, M., Wolter, K.J.
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description White light interferometry is a measuring method to acquire the shape of 3D surfaces very accurately. The paper presents an analysis of white light interferometry for its applicability in sensors for the assembly process of advanced packages. Aspects of the realization and the practical use of this measuring method for area array components are discussed.
doi_str_mv 10.1109/ISSE.2004.1490373
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identifier ISBN: 9780780384224
ispartof 27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004, 2004, Vol.1, p.42-46 vol.1
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subjects and manufacturing technology
Assembly
Components
Interference
Microscopy
Mirrors
Optical interferometry
Optical scattering
Optical sensors
packaging
Semiconductor device packaging
Shape measurement
title White light interferometry, a method for optical 3D-inspection of advanced packages
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