All lead free IGBT module with excellent reliability

All lead free IGBT module with excellent reliability

The subject of lead free solder application of IGBT module is reliability of solder under the insulated substrate in temperature cycling test. This paper presents all lead free IGBT modules with excellent reliability. This was achieved by optimizing of the thermal expansion coefficient of insulated...

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Bibliographische Detailangaben
Hauptverfasser: Nishimura, Y., Oonishi, K., Morozumi, A., Mochizuki, E., Takahashi, Y.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Ceramics
Copper
Environmentally friendly manufacturing techniques
Insulated gate bipolar transistors
Insulation
Lead
Soldering
Temperature
Thermal conductivity
Thermal expansion
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Beschreibung
Zusammenfassung:The subject of lead free solder application of IGBT module is reliability of solder under the insulated substrate in temperature cycling test. This paper presents all lead free IGBT modules with excellent reliability. This was achieved by optimizing of the thermal expansion coefficient of insulated substrate and using Sn-Ag-In solder.
ISSN:1063-6854
1946-0201
DOI:10.1109/ISPSD.2005.1487955