Circuitry analyses by using high quality image acquisition and multi-layer image merge technique

By using high quality image acquisition and multi-layer image merge technique, a technique of IC circuitry analysis has been developed and successfully applied to more than 50 industrial products analysis in one year. A series of in-house designed software ensures the successful rate to be up to 95%...

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Bibliographische Detailangaben
Hauptverfasser: Yao, H.P., Qi Zhong, Vic Ku, Lo, C.K., Wu, Y.R., Hsieh, Y.F.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:By using high quality image acquisition and multi-layer image merge technique, a technique of IC circuitry analysis has been developed and successfully applied to more than 50 industrial products analysis in one year. A series of in-house designed software ensures the successful rate to be up to 95% and the total working time to be less than 2 months for analog/mix-signal ICs of any scale and typically 10 /spl sim/100K gates counts digital devices. The software environment was also featured by multiple language, multiple users accessible, project teamwork feasible, TCL script extension support, automatic backup/restore, and GUI based in Windows, Linux, and UNIX platform.
ISSN:1946-1542
1946-1550
DOI:10.1109/IPFA.2005.1469182