Circuitry analyses by using high quality image acquisition and multi-layer image merge technique
By using high quality image acquisition and multi-layer image merge technique, a technique of IC circuitry analysis has been developed and successfully applied to more than 50 industrial products analysis in one year. A series of in-house designed software ensures the successful rate to be up to 95%...
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Format: | Tagungsbericht |
Sprache: | eng |
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Zusammenfassung: | By using high quality image acquisition and multi-layer image merge technique, a technique of IC circuitry analysis has been developed and successfully applied to more than 50 industrial products analysis in one year. A series of in-house designed software ensures the successful rate to be up to 95% and the total working time to be less than 2 months for analog/mix-signal ICs of any scale and typically 10 /spl sim/100K gates counts digital devices. The software environment was also featured by multiple language, multiple users accessible, project teamwork feasible, TCL script extension support, automatic backup/restore, and GUI based in Windows, Linux, and UNIX platform. |
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ISSN: | 1946-1542 1946-1550 |
DOI: | 10.1109/IPFA.2005.1469182 |