Use of parallel polishing technique for root cause determination of EOS devices

Use of parallel polishing technique for root cause determination of EOS devices

In this paper, a method to investigate the root cause beyond the burnt mark using a parallel polishing technique & electrical simulation is presented with case studies. It illustrated the usefulness in analyzing the failure root cause beyond the sighting of EOS burnt marks.

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Bibliographische Detailangaben
Hauptverfasser: Len, W.B., Xue, M.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Analytical models
Cause effect analysis
Chemical analysis
Chemical compounds
Earth Observing System
Electrostatic discharge
Failure analysis
Inspection
Organic materials
Performance analysis
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Beschreibung
Zusammenfassung:In this paper, a method to investigate the root cause beyond the burnt mark using a parallel polishing technique & electrical simulation is presented with case studies. It illustrated the usefulness in analyzing the failure root cause beyond the sighting of EOS burnt marks.
ISSN:1946-1542
1946-1550
DOI:10.1109/IPFA.2005.1469135