Profile-Free Copper Foil for High-Density Packaging Substrates and High-Frequency Applications

Profile-Free Copper Foil for High-Density Packaging Substrates and High-Frequency Applications

A new profile-free copper foil has been developed whose surface roughness is Rz

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Bibliographische Detailangaben
Hauptverfasser: Ogawa, Nobuyuki, Onozeki, Hitoshi, Moriike, Norio, Tanabe, Takahiro, Kumakura, Toshihisa
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Adhesives
Conductors
Copper
Gold
Packaging
Propagation losses
Rough surfaces
Surface roughness
Surface treatment
Wiring
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Beschreibung
Zusammenfassung:A new profile-free copper foil has been developed whose surface roughness is Rz
ISSN:0569-5503
2377-5726
DOI:10.1109/ECTC.2005.1441305