Dispersion analysis of packaged MMIC amplifiers using the compression approach

Dispersion analysis of packaged MMIC amplifiers using the compression approach

This paper presents the study of packaging effects on MMIC amplifiers using a global EM simulation based on the compression approach. On-wafer measurements are used as MMIC models and a single EM simulation is performed in order to describe their environment. The compression approach pennits to effi...

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Bibliographische Detailangaben
Hauptverfasser: Lesage, J.-M., Loison, R., Gillard, R., Barbier, T., Mancuso, Y.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Analytical models
Calibration
Circuit simulation
Electromagnetic measurements
Electronics packaging
Microwave technology
MMICs
Performance analysis
Performance evaluation
Semiconductor device measurement
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Zusammenfassung:This paper presents the study of packaging effects on MMIC amplifiers using a global EM simulation based on the compression approach. On-wafer measurements are used as MMIC models and a single EM simulation is performed in order to describe their environment. The compression approach pennits to efficiently simulate all chip combinations and thus to perform a dispersion analysis of the packaged MMICs.