Enhanced chip/package design for the IBM ES/9000

Enhanced chip/package design for the IBM ES/9000

The automatic placement and wiring programs used for design of the gate array bipolar chips, the TCM logical design optimization for timing, and the automated module wiring programs of the ES/9000 machines are described. An overview of related aspects of the chip and module technologies is given.<...

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Bibliographische Detailangaben
Hauptverfasser: Belanger, R.S., Conrady, D.P., Honsinger, P.S., Lavery, T.J., Rothman, S.J., Schanzenback, E.C., Sitaram, D., Selinger, C.R., DuBois, R.E., Mahoney, G.W., Miceli, G.F.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Circuits
Delay estimation
Design optimization
Libraries
Packaging
Programmable logic arrays
Timing
Wire
Wiring
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Beschreibung
Zusammenfassung:The automatic placement and wiring programs used for design of the gate array bipolar chips, the TCM logical design optimization for timing, and the automated module wiring programs of the ES/9000 machines are described. An overview of related aspects of the chip and module technologies is given.< >
DOI:10.1109/ICCD.1991.139969