Application of ABAQUS/Explicit submodeling technique in drop simulation of system assembly

In this paper, an impact analysis procedure coupled with submodeling technique in ABAQUS/Explicit under version 6.3 was established. A nested submodeling technique was adapted from a system assembly level global model to an electronic package component (first level submodel) and then to a solder ball (second level submodel) in the drop simulation. As a demonstration, a dummy PWB board drop vehicle was first used to verify the proposed procedures using submodeling technique in ABAQUS/Explicit. The results show that in general, submodeling technique in ABAQUS/Explicit provides very positive solutions for displacements, stresses (strains) and accelerations. Then, based on the framework developed, this technique was implemented into system assembly drop simulation. The whole approach starts from an initial global linear analysis of the selected system assembly to identify component areas where the response to the loading is deemed vital. Then, these component areas are enhanced through remeshing and linear reanalyzing to determine crucial solder joint. Finally, the crucial solder joint is refined via remeshing and nonlinear reanalyzing.