Effects of packaging design on the performance of TWEAM module for digital and analog applications

With optimized packaging design, 40 Gbps broadband TWEAM module and 40 GHz band TWEAM module were developed. The packaging technology included resonance suppression in broadband and impedance matching at 40 GHz in narrowband.

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Bibliographische Detailangaben
Hauptverfasser:	CHOI, Kwang-Seong, LEE, Jong-Hyun, LIM, Jiyoun, KANG, Young-Shik, CHUNG, Yong-Duck, MOON, Jong-Tae, KIM, Jeha
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Applied sciences Coplanar waveguides Design. Technologies. Operation analysis. Testing Detection, estimation, filtering, equalization, prediction Digital modulation Electrodes Electronics Electronics packaging Exact sciences and technology Frequency response Impedance matching Information, signal and communications theory Integrated circuits Optical modulation Radio frequency Resonance Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Signal and communications theory Signal, noise Systems, networks and services of telecommunications Telecommunications Telecommunications and information theory Transmission and modulation (techniques and equipments) Wavelength division multiplexing
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Beschreibung
Zusammenfassung:	With optimized packaging design, 40 Gbps broadband TWEAM module and 40 GHz band TWEAM module were developed. The packaging technology included resonance suppression in broadband and impedance matching at 40 GHz in narrowband.
DOI:	10.1109/LEOS.2004.1363339