Packaging of highly integrated PLC components

We discuss the progress of packaging techniques for highly integrated planar lightwave circuit (PLC) devices. Examples of thermal effects and the integration of power monitors demonstrate interactions between building blocks and the environment.

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Bibliographische Detailangaben
Hauptverfasser:	Krabe, D., Heise, G., Zavrsnik, M., Dieckroeger, J., Gao, Z., Schinke, C., Scheubeck, M., Kraeker, T., Krombholz, B., Baumann, I.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Circuits Electronic packaging thermal management Integrated optics Optical attenuators Optical devices Optical filters Optical network units Programmable control Stimulated emission Thermal management
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Beschreibung
Zusammenfassung:	We discuss the progress of packaging techniques for highly integrated planar lightwave circuit (PLC) devices. Examples of thermal effects and the integration of power monitors demonstrate interactions between building blocks and the environment.