A 1.2Gb/s/pin wireless superconnect based on inductive inter-chip signaling (IIS)

A wireless bus for stacked chips is designed with the interface using inductive coupling with metal spiral inductors. Transceiver circuits non-return-to-zero signaling are developed. Test chips stacked at a distance of 300/spl mu/m communicate at data rates of up to 1.2Gb/s/pin. Fabricated in 0.35/s...

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Hauptverfasser:	Mizoguchi, D., Yusof, Y.B., Miura, N., Sakura, T., Kuroda, T.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Applied sciences Coupling circuits Design. Technologies. Operation analysis. Testing Electronics Exact sciences and technology Inductors Integrated circuit interconnections Integrated circuits Low pass filters Magnetic analysis Packaging Protection Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Three-dimensional integrated circuits Transmitters Voltage
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