Design and analysis of novel glass WLCSP structure

A novel glass wafer level chip scaled packaging (WLCSP) structure is proposed herein to resolve the challenge faced by packaging houses to modify their mass-production packaging equipment from an 8" wafer process to a 12" one, due to the increasing demand of the semiconductor manufacturers' 12" wafer process. The finite element method and parametric analysis are applied to obtain a robust design parameter for the proposed glass WLCSP structure. This novel packaging structure comprises a chip that is first diced from the 12" wafer and is attached to 8" glass. Then the conventional 8" WLCSP process can be accomplished on this 8" glass. After the validation of the solder joint stand-off height, a finite element model is conducted to elucidate the reliability issues of the proposed glass WLCSP. The simulation results show that the robust design parameters could enhance the reliability of the proposed glass WLCSP structure by about 3.5 times, compared to the original design parameters.