Study on simulation-based optimization for flip chip package parameters by using RSM analysis and Ant algorithm

Study on simulation-based optimization for flip chip package parameters by using RSM analysis and Ant algorithm

In this paper, a simulation-based optimization methodology combining the Response Surface Method (RSM) and a newly developed Ant Algorithm is introduced. An approximate function between the chief packaging parameters and the maximum value of the equivalent stress in the solder joints has been built....

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Quanyong Li, Yubing Gong, Daoguo Yang, Junsheng Liang
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Algorithm design and analysis
Analytical models
Assembly
Electronics packaging
Flip chip
Iron
Silicon
Soldering
Thermal expansion
Thermal stresses
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Beschreibung
Zusammenfassung:In this paper, a simulation-based optimization methodology combining the Response Surface Method (RSM) and a newly developed Ant Algorithm is introduced. An approximate function between the chief packaging parameters and the maximum value of the equivalent stress in the solder joints has been built. Finally, the better solution of the chief packaging parameters is obtained from Ant Algorithm.
DOI:10.1109/EPTC.2003.1298698