Packaging R&D in Singapore

This paper gives an overview of electronic, optical and MEMS packaging activities in Singapore from both components and microsystems perspective. A brief introduction to Singapore's electronic sector is provided. The research and development focus and industry collaborations are discussed. The...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Iyer, M.K., Too Poi Siong, Teo Kong Hwa, Lim Thiam Beng
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Assembly Collaboration Electronics industry Electronics packaging Industrial electronics Micromechanical devices Research and development Semiconductor device manufacture Semiconductor device packaging Wafer scale integration
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