Packaging R&D in Singapore

This paper gives an overview of electronic, optical and MEMS packaging activities in Singapore from both components and microsystems perspective. A brief introduction to Singapore's electronic sector is provided. The research and development focus and industry collaborations are discussed. The...

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Bibliographische Detailangaben
Hauptverfasser:	Iyer, M.K., Too Poi Siong, Teo Kong Hwa, Lim Thiam Beng
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Assembly Collaboration Electronics industry Electronics packaging Industrial electronics Micromechanical devices Research and development Semiconductor device manufacture Semiconductor device packaging Wafer scale integration
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Beschreibung
Zusammenfassung:	This paper gives an overview of electronic, optical and MEMS packaging activities in Singapore from both components and microsystems perspective. A brief introduction to Singapore's electronic sector is provided. The research and development focus and industry collaborations are discussed. The collaborations between universities and research institutes of Singapore in the areas of system integration, electro optical module development, wafer level packaging and integration and MEMS packaging are discussed.
DOI:	10.1109/EPTC.2003.1298686