Modular parametric finite element modelling for reliability-studies in electronic and MEMS packaging

A modular and parametric approach to FE-modelling is presented which allows rapid virtual prototyping for MEMS and other microelectronics packages with respect to some topical reliability issues: Thermal management and thermo-mechanical fatigue. Thereby the method of automatic model generation by mo...

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Bibliographische Detailangaben
Hauptverfasser:	Wunderle, B., Auersperg, J., Grosser, V., Kaulfersch, E., Wittler, O., Michel, B.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Applied sciences Design. Technologies. Operation analysis. Testing Electronic packaging thermal management Electronics Electronics packaging Exact sciences and technology Fatigue Finite element methods Integrated circuits Micro- and nanoelectromechanical devices (mems/nems) Microelectronics Micromechanical devices Rapid thermal processing Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Thermal management Thermomechanical processes Virtual prototyping
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Beschreibung
Zusammenfassung:	A modular and parametric approach to FE-modelling is presented which allows rapid virtual prototyping for MEMS and other microelectronics packages with respect to some topical reliability issues: Thermal management and thermo-mechanical fatigue. Thereby the method of automatic model generation by modular parametric modelling is outlined and some examples featuring the required solution techniques are given. This simulation procedure forms part of a comprehensive design optimisation process in the field of predictive engineering.
DOI:	10.1109/DTIP.2003.1287063